Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1C12F256C8 FPGA from Intel is a pivotal component in the Cyclone® series, renowned for its exceptional performance and reliability in various applications. Designed with a 256-BGA package, this surface mount FPGA operates within a temperature range of 0°C to 85°C, making it suitable for a wide array of operating environments.
Key Features:
– Manufacturer: Intel
– Series: Cyclone®
– Part Number: EP1C12F256C8
– Package: 256-BGA, ensuring high-density integration
– Mounting Type: Surface Mount for efficient assembly processes
– Operating Temperature: Capable of withstanding 0°C to 85°C, suitable for most industrial applications
– Logic Elements/Cells: Contains 12060, enabling complex digital computations
– LABs/CLBs: Total of 1206, for intricate logic operations
– Total RAM Bits: Offers 239616 bits, providing substantial memory capabilities
– I/O Pins: Features 185 input/output pins, accommodating extensive peripheral connectivity
– Packaging: Supplied in trays, designed for secure handling and storage
– Part Status: Noted as Obsolete, highlighting the need for strategic purchasing decisions
Despite its status, the EP1C12F256C8 is a powerful FPGA widely utilized in the design and development of advanced digital systems across various industries, including telecommunications, automotive, and consumer electronics. Its ability to execute parallel processing tasks efficiently makes it a preferred choice for developers working on high-speed digital signal processing (DSP), embedded systems, and complex logic circuits.
Given its comprehensive feature set and the Cyclone® series’ reputation for reliability and flexibility, the EP1C12F256C8 remains an influential component in the creation of innovative and high-performance electronic solutions.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.425V ~ 1.575V |
Number of Logic Elements/Cells | 12060 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 1206 |
Total RAM Bits | 239616 |
Part Status | Obsolete |
Number of I/O | 185 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
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DICE (WAFER SAWN) - WAFFLE PACK
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DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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