The EP1C12F256C7N, a field-programmable gate array (FPGA) from Intel’s Cyclone® series, comes in a 256-ball grid array (BGA) packaging designed for surface mount technology. This component operates within a temperature range of 0°C to 85°C, making it suitable for a variety of applications that do not exceed this thermal threshold. It features 12,060 logic elements/cells and 1,206 logic array blocks/clusters (LABs/CLBs), providing a robust framework for complex digital circuits. With a total of 239,616 RAM bits, this FPGA offers substantial memory capacity for data storage and manipulation.

The device supports 185 input/output (I/O) pins, allowing for versatile connectivity with other components within a system. Packaged in a 256-FBGA (17×17) format, it is tailored for projects requiring a compact yet flexible hardware solution. Despite its status as an obsolete part, the EP1C12F256C7N remains a powerful choice for designers looking to leverage Intel’s Cyclone® series’ reliability and performance in their projects.

Commonly used in telecommunications, consumer electronics, automotive systems, and industrial controls, this FPGA enables the development and implementation of custom logic functions, adapting to the specific needs and constraints of diverse applications. Its combination of high logic capacity, substantial memory, and broad operating temperature range make it a versatile solution for a wide range of electronic designs.