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EP1C12F256C7

IC FPGA 185 I/O 256FBGA

Manufacturer:

$56.83

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The EP1C12F256C7, manufactured by Intel, stands as a notable component within the Cyclone® FPGA series, offering advanced features tailored for complex digital circuit designs. This FPGA is packaged in a 256-BGA format, suitable for surface mount technology, ensuring a seamless fit for sophisticated PCB layouts. Its architecture is designed to foster efficient logic integration, evidenced by its comprehensive array of features:

– **Number of Logic Elements/Cells**: 12,060, providing a robust foundation for implementing versatile digital functionalities.
– **Supplier Device Package**: 256-FBGA (17×17), optimized for efficient space utilization on printed circuit boards.
– **Number of LABs/CLBs**: 1,206, which are fundamental in creating customizable logic blocks for a wide range of applications.
– **Total RAM Bits**: 239,616, offering substantial memory capacity for intermediate data storage or complex algorithm implementations.
– **Part Status**: Obsolete, indicating a shift towards newer technologies but still in demand for specific legacy systems.

With an operating temperature range of 0°C to 85°C, the EP1C12F256C7 ensures reliability across various environments, making it an ideal choice for:

– High-performance computing systems
– Industrial automation
– Telecommunications infrastructure
– Automotive electronics
– Consumer electronics

Furthermore, it supports 185 I/O pins, enabling extensive interfacing capabilities with peripherals and other digital systems, thereby enhancing its adaptability to multifaceted electronic designs.

In conclusion, the Intel Cyclone® EP1C12F256C7 FPGA offers a compelling combination of flexibility, performance, and capacity, ideal for developing sophisticated electronic systems across a broad spectrum of industries.

Additional information

Additional Information

Series: Cyclone®
RoHS Status: RoHS non-compliant
Manufacturer Lead Time: No lead time information available
Product Status: Obsolete
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case256-BGA
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Voltage - Supply1.425V ~ 1.575V
Number of Logic Elements/Cells12060
Supplier Device Package256-FBGA (17x17)
Number of LABs/CLBs1206
Total RAM Bits239616
Part StatusObsolete
Number of I/O185
ProgrammableNot Verified
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