Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP1C12F256C7, manufactured by Intel, stands as a notable component within the Cyclone® FPGA series, offering advanced features tailored for complex digital circuit designs. This FPGA is packaged in a 256-BGA format, suitable for surface mount technology, ensuring a seamless fit for sophisticated PCB layouts. Its architecture is designed to foster efficient logic integration, evidenced by its comprehensive array of features:
– **Number of Logic Elements/Cells**: 12,060, providing a robust foundation for implementing versatile digital functionalities.
– **Supplier Device Package**: 256-FBGA (17×17), optimized for efficient space utilization on printed circuit boards.
– **Number of LABs/CLBs**: 1,206, which are fundamental in creating customizable logic blocks for a wide range of applications.
– **Total RAM Bits**: 239,616, offering substantial memory capacity for intermediate data storage or complex algorithm implementations.
– **Part Status**: Obsolete, indicating a shift towards newer technologies but still in demand for specific legacy systems.
With an operating temperature range of 0°C to 85°C, the EP1C12F256C7 ensures reliability across various environments, making it an ideal choice for:
– High-performance computing systems
– Industrial automation
– Telecommunications infrastructure
– Automotive electronics
– Consumer electronics
Furthermore, it supports 185 I/O pins, enabling extensive interfacing capabilities with peripherals and other digital systems, thereby enhancing its adaptability to multifaceted electronic designs.
In conclusion, the Intel Cyclone® EP1C12F256C7 FPGA offers a compelling combination of flexibility, performance, and capacity, ideal for developing sophisticated electronic systems across a broad spectrum of industries.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.425V ~ 1.575V |
Number of Logic Elements/Cells | 12060 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 1206 |
Total RAM Bits | 239616 |
Part Status | Obsolete |
Number of I/O | 185 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 300 I/O 536CSPBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA ARTIXUP 484BGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 475 I/O 672FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 226 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
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