The APA600-BG456I is a sophisticated FPGA (Field-Programmable Gate Array) component, developed and manufactured by Microchip Technology, under the well-regarded ProASICPLUS series. This product is presented in a 456-BBGA (Ball Grid Array) package, designed for surface mount technology, ensuring a secure and compact integration into a wide array of electronic assemblies.

With an operating temperature range of -40°C to 85°C, the APA600-BG456I ensures reliable performance across various environmental conditions, making it suitable for deployment in industries with demanding requirements such as automotive, aerospace, and industrial automation. The device’s package size is specified as 456-PBGA, measuring 35×35 mm, optimizing its footprint on circuit boards while providing ample functionality.

In terms of memory and processing capabilities, this FPGA boasts a total of 129,024 RAM bits, facilitating complex digital computations and data manipulation tasks. Furthermore, it offers a generous number of I/O ports, totaling 356, which provides extensive connectivity options for peripheral devices and interfaces, addressing the needs of sophisticated electronic systems.

The APA600-BG456I remains in an active part status, indicating its continued production and availability for new designs and maintenance of existing applications. This component exemplifies Microchip Technology’s commitment to delivering high-performance silicon solutions that address the evolving needs of the technology sector, from consumer electronics to mission-critical system components in specialized industries.