The APA1000-FG896A, a paramount component from Microchip Technology’s ProASICPLUS series, boasts the reliability and performance sought after by professionals in various demanding industries. This FPGA (Field Programmable Gate Array) is encapsulated in a 896-BGA (Ball Grid Array) package, catering to the advanced requirements for robust, high-density integrated solutions. The packaging type is Tray, denoting a standard delivery form factor for such high precision components.

As a surface mount device, it is designed for streamlined integration onto printed circuit boards, facilitating the dense packaging and complex circuit designs emblematic of today’s leading-edge electronic systems. The 896-FBGA package, measuring approximately 31×31 mm, emphasizes the compact, yet powerful nature of this component, allowing for efficient use of board space without compromising performance.

Operating across a temperature range of -40°C to 125°C (TJ), the APA1000-FG896A ensures reliability and functionality in a wide spectrum of environments, making it suitable for applications that demand stability under extreme conditions. With a total of 202,752 RAM bits and 642 I/O pins, it provides ample flexibility and capacity for handling complex digital processing tasks and interfacing with other components within a system.

This FPGA is a fundamental building block in the development and deployment of solutions in industries such as telecommunications, automotive, aerospace, and consumer electronics, where performance, reliability, and adaptability are non-negotiable. The current active status of the part ensures ongoing support and availability for both existing systems and new projects requiring cutting-edge technology and high levels of customization.