The APA075-PQG208I, developed by Microchip Technology, represents a cutting-edge FPGA (Field-Programmable Gate Array) within the esteemed ProASICPLUS series. This high-performance component is engineered in a 208-BFQFP (Bumpered Quad Flat Pack) format, designed for surface mount technology (SMT) applications, which ensures seamless integration into a wide range of electronic systems.

This particular model is noted for its operational reliability across a broad temperature range of -40°C to 85°C (TA), making it suitable for deployment in environments that experience extreme conditions. It is packaged conveniently in trays, facilitating efficient handling and storage. The device package is described as 208-PQFP (28×28), optimizing the balance between performance and footprint on the system board.

Key technical specifications of the APA075-PQG208I include a substantial provision of 27648 total RAM bits and an impressive array of 158 I/O ports, allowing for versatile connectivity and high flexibility in designing complex, multifunctional systems. This FPGA remains in an active part status, indicating ongoing manufacturing and support from Microchip Technology.

Applications and industries that benefit from the APA075-PQG208I encompass:

– Telecommunications equipment
– Aerospace and defense projects
– Industrial control systems
– Medical devices requiring high reliability

Features at a glance:
– Manufactured by Microchip Technology
– Part of the ProASICPLUS series
– 208-BFQFP package for SMT
– Operates within -40°C to 85°C
– 208-PQFP (28×28) device packaging
– Contains 27648 RAM bits
– Equipped with 158 I/O ports
– Packaged in a tray for easy handling

The APA075-PQG208I is engineered to meet the demands of sophisticated electronic systems, providing both versatility and reliability in a wide array of applications that require high-performance FPGA solutions.