The A3P250-PQG208I, crafted by industry leader Microchip Technology, stands as a sophisticated entity within the FPGA (Field-Programmable Gate Array) category, specifically within the esteemed ProASIC3 series. This component is packaged meticulously in a tray format, ensuring secure delivery and handling. It is encapsulated within a 208-BFQFP (Bumpered Flat Quad Flat Package), designed precisely for surface mount technology, facilitating seamless integration into a broad array of circuit designs.

Sporting an operating temperature range from -40°C to 100°C (TJ), this FPGA demonstrates remarkable resilience and performance stability under a variety of environmental conditions. It is housed in a 208-PQFP (28×28), a package known for its efficient layout and thermal characteristics, making it an ideal choice for sophisticated applications demanding high reliability and longevity.

With a total of 36,864 RAM bits and an impressive 151 I/O (Input/Output) ports, the A3P250-PQG208I provides substantial flexibility and capacity for handling complex designs and computations. This component remains in an active part status, indicating continuing production and support from Microchip Technology.

Given its robust feature set, the A3P250-PQG208I is perfectly suited for deployment in various high-demand industries such as telecommunications, automotive, aerospace, and consumer electronics, where performance and reliability are paramount. Its advanced technical specifications cater to the intricate needs of complex digital circuitry, enabling designers and engineers to push the boundaries of innovation and efficiency in their projects.