The 5SGXMA7H3F35C2LG, manufactured by Intel, is a part within the category of FPGAs and a prominent member of the Stratix® V GX series. This component offers high performance through an operating temperature of 0°C ~ 85°C (TJ) which confirms its durability and robust usage under diverse conditions. Complete with 622,000 Logic Elements/Cells and 234,720 LABs/CLBs, the performance potential for this device is massive.

This component’s meticulous packaging in a tray paired with its 1152-BBGA, FCBGA package/case represents a critical aspect of Intel’s commitment to delivering high-quality FPGAs. It features surface mountability which enhances flexibility during installation. With a hefty supply of a total of 51,200,000 RAM Bits, the 5SGXMA7H3F35C2LG is more than equipped in handling comprehensive data operations.

The device, which is currently active, incorporates a supplier device package of 1152-FBGA (35×35), adding an increase in its performance metrics. Combined with an impressive number of 552 I/O, this FPGA ranks among the most efficient and responsive in the market.

The Intel 5SGXMA7H3F35C2LG FPGA, thus, stands as a high-functioning, adaptable component that bolsters a variety of integrated circuit designs. Whether it’s for industries that rely heavily on reliable and efficient circuits like telecommunications, robotics, automotive or computing, this part’s significant performance capacity makes it a robust tool for dependable data operations.