The 5SGXMA7H3F35C2G is a noteworthy FPGA (Field Programmable Gate Array) from the illustrious Stratix® V GX series, manufactured by Intel. This highly capable FGPA is supplied in the 1152-BBGA, FCBGA package format and is shipped in trays. It offers surface mount technology, suitable for a broad spectrum of applications where facet-wise component placement is required on a PCB.

The device comprises 622,000 logic elements/cells, contributing to its high-performance processing capabilities and making it a suitable choice for complex logic circuit designs. It comes with 512,000,000 total RAM bits and 234,720 LABs/CLBs, augmenting its storage and routing control. This high pin-count FPGA, with 552 I/Os, provides extensive interfacing opportunity, a characteristic that greatly contributes to system level design flexibility.

The 5SGXMA7H3F35C2G operates within the temperature range of 0°C ~ 85°C, rendering it remarkably suitable for high-performance computing, aerospace, medical, defense, and communication systems.

As a part of the Intel’s Stratix® V GX series, this FPGA is built on state-of-the-art 28 nm process technology and features superior signal integrity, making it a robust choice for system designers seeking a balance of high performance, low power, and cost efficacy.

The device is currently in active part status, indicating its availability and support for both new designs and existing applications. The supplier device package is the 1152-FBGA (35×35). This powerful FPGA undoubtedly offers exceptional versatility, making it a go-to choice for high-end, complex system designs.