The Intel 5SGXEB6R1F43C2LG is a high-performance FPGA, part of the prestigious Stratix® V GX series. This component stands out for its surface mount mounting type and an impressive operating temperature range of -40°C ~ 100°C (TJ), ideal for demanding conditions.

Key Specifics:
– Package / Case: The package / case configuration of 1760-BBGA, FCBGA is designed to accommodate large scale fabrication, fulfilling complex manufacturing needs.
– Number of Logic Elements/Cells: It comes with 597,000 logic elements/ cells, offering high-capacity logic density to cope with sophisticated design objectives.
– Number of LABs/CLBs: The 225,400 LABs/CLBs perfectly complements the high-volume, high-speed data flows.
– Total RAM Bits: Armed with an impressive 53,248,000 total RAM bits, it guarantees data-intensive operations will run smoothly with minimal latency.
– Number of I/O: This FPGA comes equipped with a significant 600 I/Os, offering various interfacing options for flexible designs.

This FPGA’s packaging form factor is a tray. The supplier device package is expressly designed as a 1760-FCBGA (42.5×42.5), which signifies a significant achievement in semiconductor design and capabilities. As an active component, Intel’s FPGA continues to offer reliable and efficient computational operations within the FPGA market sector. This FPGA is commonly employed in high-demand industries like telecommunications, datacenters, high-performance systems, and military technology. The Intel 5SGXEB6R1F43C2LG is indeed synonymous with high-capacity loads and extensive interfacing, a defining factor in many cutting-edge, data-intensive operations.