The 5SGXEA5N2F45I3LG, manufactured by Intel, falls under the category of field-programmable gate arrays (FPGAs) particularly from the Stratix® V GX series. Expertly designed to function within a demanding operating temperature range of -40°C to 100°C (TJ), this state-of-the-art chip demonstrates impressive resilience under varied ambient conditions.

The component comes in a 1932-BBGA, FCBGA package or case, readily built for surface mount assembly. Moreover, it’s supplemented by the supplier device package of 1932-FBGA, FC (45×45). The packaging for this exceptional FPGA is performed in a Tray format, ensuring the safe handling and preservation of the component during transport or storage.

Packed with nuances such as the inclusion of 490000 logic elements/cells for handling complex operations and 185000 lookup table/blocks, the 5SGXEA5N2F45I3LG promises outstanding computational capabilities. Further enhancing the device’s functionality is the exceptional total RAM bit capacity of 46080000, allowing it to process large volumes of data efficiently.

Remarkably, the component boasts 840 I/O’s, offering excellent interface flexibility. Having an active part status, the 5SGXEA5N2F45I3LG continues to be a sought-after solution across several industries.

Key Features:

– Manufacturer: Intel
– Series: Stratix® V GX
– Number of Logic Elements/Cells: 490000
– Total RAM Bits: 46080000
– Operating Temperature range: -40°C ~ 100°C (TJ)
– Number of LABs/CLBs: 185000
– Number of I/O: 840
– Packaging: Tray format
– Package / case options: 1932-BBGA, FCBGA
– Mounting type: Surface Mount
– Supplier Device Package: 1932-FBGA, FC (45×45)
– Part status: Active