The 5SGXEA3H2F35C2LG, manufactured by Intel, is a member of the Stratix® V GX series of FPGAs (Field-Programmable Gate Arrays). This high-performance chip is designed for surface mount applications and comes packaged in a tray. The device caters to an operating temperature range between 0°C and 85°C (TJ).

Featured with robust configuration of a staggering 340,000 logic elements or cells, the chip offers the right balance of functionality and efficiency. This component further boasts 128,300 LABs/CLBs and 19,456,000 total RAM bits, providing considerable firepower for your processing needs.

Packaged in a sophisticated 1152-BBGA, FCBGA supplier device package with a physical dimension of 35×35, it provides a compact footprint without compromising on the performance. You get a substantial number of 432 I/Os, thus enabling this FPGA with a broad range of interfacing opportunities.

The 5SGXEA3H2F35C2LG is currently in active production, demonstrating Intel’s commitment to providing reliable, long-term supplies of their top-tier products. It’s extensively leveraged in diverse industries such as communication, industrial, defense, and medical, thanks to its versatility and high-end capabilities. It’s a testament to Intel’s pioneering spirit in creating an FPGA capable of powering the next generation of high-performance systems.