Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel 5CEBA2F17A7N is a high-performance FPGA (Field-Programmable Gate Array) from their prestigious Cyclone® V E series. Offered in tray packaging, this unit is a powerful 256-LBGA (Low Profile Ball Grid Array) component designed for surface mount applications. Engineered for operational excellence in temperature ranges between -40°C and 125°C, this FPGA demonstrates superior functionality in a variety of adverse environmental conditions. The active status of the part reflects its ongoing production and availability.
A standout feature of the Intel 5CEBA2F17A7N is the 25000 logic elements/cells it possesses. Such an extensive cell volume makes this component an ideal choice for managing complex computations and intricate digital tasks. Capability is bolstered by 9434 LABs/CLBs (Logic Array Blocks / Complex Logic Blocks) that enhance functional diversity, providing ample adaptive capacity for a multitude of applications.
Additionally, the Intel 5CEBA2F17A7N has a superb memory with total RAM bits reaching 2002944, ensuring a high data transfer rate and excellent performance in high-speed communication systems. Also, its impressive array of 128 I/O (Inputs/Outputs) allows it to interface effectively with various peripheral devices, enhancing its usability across industries such as telecommunications, information technology, defense, and aerospace.
The supplier device package is a 256-FBGA (17×17), providing a robust platform for efficient integration into circuit designs. This FPGA’s specification repertoire positions the Intel 5CEBA2F17A7N as a top-tier component for intellectually nuanced and technically demanding applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 256-LBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 125°C (TJ) |
Voltage - Supply | 1.07V ~ 1.13V |
Number of Logic Elements/Cells | 25000 |
Supplier Device Package | 256-FBGA (17x17) |
Number of LABs/CLBs | 9434 |
Total RAM Bits | 2002944 |
Part Status | Active |
Number of I/O | 128 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
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DICE (WAFER SAWN) - WAFFLE PACK
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TSSOP / 16 / 5X4MM-0
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