The 5AGXFB1H4F35I3G is a high-performance FPGA component from the Arria V GX series by Intel. With a total of 300,000 logic elements or cells, it offers ample complexity and performance for serious applications. Intel notably provides this component in a tray packaging, and its package case is the 1152-BBGA, FCBGA Exposed Pad, a proven format for secure and reliable FPGAs.

This FPGA is suitable for surface mount, and it operates efficiently in a wide temperature range – from -40°C up to 100°C (Tj), ensuring resilience in different environmental conditions. This optimized FPGA comes with 14,151 LABs/CLBs and features a significant 17,358,848 RAM bits providing superior data handling capabilities.

Further, the dynamic 5AGXFB1H4F35I3G is furnished with a 544 number of I/O, offering considerable versatility for interfacing with other elements of your system effectively. Designed for active part status, this FPGA is applicable across varied demanding industries, including automotive, aerospace, defense, telecommunications, and beyond. For necessary specifications, the supplier device package is 1152-FBGA (35×35).

Equipment designers may leverage the advanced technology in Intel’s Arria V GX series FPGA to create highly differentiated systems. By offering increased integration and reduced power, the 5AGXFB1H4F35I3G is positioned to enhance the performance and operational efficiency of next-generation electronics systems.