Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Introducing the Arria V GX series Field-Programmable Gate Array (FPGA) from Intel, specified with the part number 5AGXBB3D4F35I5G. This active component comes in a 1152-BBGA, FCBGA exposed pad package. It is an integrated device that is ideal for mounting on a surface with its surface mount strategy. It is engineered to handle an operating temperature range of -40°C to 100°C (TJ), delivering proven operational reliability within this temperature spectrum.
This crucial part is packaged in a tray and comes with a supplier device package made of 1152-FBGA (35×35), built to endure and maintain optimal function under stress.
This Intel FPGA possesses an impressively large number of Logic Elements/Cells totaling to 362000, accompanied by 17110 number of LABs/CLBs providing a vast playground for versatile and intensive applications.
Moreover, it comes with a bounteous total RAM bits of 19822592, ensuring higher performance potential and efficient handling of data-heavy tasks. It also facilitates connectivity and data transfer with a generous number of I/O amounting to 544.
This component is widely recognized in various industries such as telecommunications, digital signal processing, aerospace defense, and many more, exhibiting its adaptability and efficiency across diverse applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 1152-BBGA, FCBGA Exposed Pad |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.07V ~ 1.13V |
Number of Logic Elements/Cells | 362000 |
Supplier Device Package | 1152-FBGA (35x35) |
Number of LABs/CLBs | 17110 |
Total RAM Bits | 19822592 |
Part Status | Active |
Number of I/O | 544 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 248 I/O 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 186 I/O 256FBGA
IC FPGA 322 I/O 484FBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
IC FPGA 315 I/O 484FBGA
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