The 10M16DCU324I7G, manufactured by Intel, falls within the realm of advanced FPGAs, specifically belonging to the MAX® 10 series. This powerful Field-Programmable Gate Array is packaged in a tray and features a 324-LFBGA package/case. Planned for surface mount application, the device operates impeccably within an operating temperature range of -40°C to 100°C (TJ).

The 10M16DCU324I7G, being part of Intel’s MAX® 10 series, is a representation of high performance and adaptability. It boasts 16,000 Logic Elements/Cells, which allow for elaborate digital computations, making it an incredibly useful tool for various complex electronic designs. For packaging purposes, the provider employs a 324-UBGA (15×15) Supplier Device Package.

In addition, this FPGA incorporates 1000 LABs/CLBs, offering substantial flexibility during design implementation. Furthermore, the total RAM bits stand at 562176, providing sufficient memory capacity for demanding applications.

This active part is equipped with an impressive 246 I/O, making it highly versatile in terms of compatibility with multiple devices.

The Intel 10M16DCU324I7G has established its relevance in several industrial applications, such as telecommunications, consumer electronics, aerospace, and medical devices for its efficient performance and high programmability. As a result, this Intel FPGA contributes positively to improving the computational capabilities of various high-tech equipment.