The XCR3128XL-10CS144I, part of AMD’s CoolRunner XPLA3 series, encapsulates the latest in CPLD (Complex Programmable Logic Devices) technology. This component is delivered in a tray packaging format, emphasizing the readiness for integration into production processes. With its sophisticated 144-TFBGA (Thin Film Ball Grid Array), CSPBGA (Chip Scale Package Ball Grid Array) packaging, the device is optimized for high-density mounting on PCBs, highlighting its suitability for compact and space-constrained applications.

Designed with a Surface Mount technology for efficient assembly and manufactured to operate reliably within a broad temperature range of -40°C to 85°C (TA), this CPLD guarantees robust performance across various environmental conditions. The XCR3128XL-10CS144I is housed in a 144-LCSBGA (12×12) package, meticulously crafted to meet the stringent requirements of modern electronic circuit designs.

Offering an ample array of 108 I/O ports, this part by AMD provides an expansive interface capability, making it an ideal choice for a vast array of applications, including but not limited to telecommunications, networking, automotive systems, and consumer electronics. The active part status of the XCR3128XL-10CS144I confirms its ongoing availability and support for integration into new designs or for use in updating existing systems.

Engineers and professionals in the field will appreciate the device’s intricate balance of power efficiency, performance, and flexibility provided by AMD’s pioneering CPLD technology encapsulated within the CoolRunner XPLA3 series. This component represents a flagship solution for complex logic operations, demanding minimal power consumption without sacrificing speed or functionality.