The XC2C512-7FTG256I, engineered by AMD, encapsulates the pinnacle of complexity and efficiency found within the CoolRunner II series of CPLDs (Complex Programmable Logic Devices). This component is specifically packaged in a 256-LBGA (Ball Grid Array) format, ensuring a compact form factor and the ease of surface mount technology integration into a diverse array of electronic systems.

Features and specifications of the XC2C512-7FTG256I include:

– Part of the AMD’s reputable CoolRunner II series, signifying its advanced power management and high-speed operation capabilities.
– The package is delivered in a tray format, with the device itself encased in a robust 256-FTBGA (17×17) supplier package, optimizing both thermal performance and reliability.
– Designed to function reliably within a broad operating temperature range of -40°C to 85°C, making it suitable for use in environments experiencing temperature extremes.
– It offers a substantial number of I/O options with 212 available, providing ample flexibility for interfacing with a wide array of external devices and signals.
– The part maintains an active status, ensuring continued support and availability for new designs and legacy support.

Industries that heavily benefit from the deployment of the XC2C512-7FTG256I include, but are not limited to, telecommunications, automotive systems, consumer electronics, and industrial automation. Its versatility and high performance make it an indispensable component in the development and enhancement of complex digital systems requiring reliable programmable logic solutions.