The EPM7256AEQC208-7N by Intel falls under the category of Complex Programmable Logic Devices (CPLDs), specifically from the renowned MAX® 7000A series. This device showcases a delicate balance between high performance and extensive utility within a 208-BFQFP (Bumped Flat Quad Flat Package), catering to the need for advanced packaging technology in circuit design. It comes in a standard tray packaging format, designed for surface mount technology (SMT) applications, ensuring seamless integration into various circuit board layouts.

With an extensive array of 164 I/O (Input/Output) points, this CPLD provides ample connectivity for complex digital logic circuits, underpinning its utility in designing versatile and high-density logic applications. The operating temperature range of 0°C to 70°C (TA) ensures reliable performance across a spectrum of environmental conditions, making it suitable for a wide range of industrial applications.

The EPM7256AEQC208-7N is encapsulated within a 208-PQFP (28×28) package, providing a compact yet robust platform for the development of sophisticated digital systems. Although marked as obsolete, its advanced feature set remains valuable for professionals engaged in the maintenance, repair, or iterative development of legacy systems across industries where reliability and precision are paramount.

Intel’s MAX® 7000A series, including the EPM7256AEQC208-7N, has historically found extensive application across various sectors, including telecommunications, automotive electronics, and consumer electronic devices, where its ability to perform high-speed logic operations significantly contributes to the efficiency and advancement of electronic systems.