The EPM570GF256C5N is a high-density Complex Programmable Logic Device (CPLD) from Intel’s respected MAX® II series, catering to the advanced requirements of modern digital circuit design. Housed in a 256-ball grid array (BGA) package, this CPLD is designed for surface-mount technology, providing robustness and reliability in various application environments.

With a versatile operating temperature range of 0°C to 85°C, the EPM570GF256C5N ensures reliable performance across a broad spectrum of conditions, thereby making it an ideal choice for high-demand applications. It boasts a substantial number of I/O pins, offering a total of 160 interfaces which allow for flexible connections with other components within a system.

Its compact form factor, represented by the supplier device package specification of 256-FBGA (17×17), combined with its Tray packaging option, facilitates efficient assembly and integration into a multitude of device platforms. This makes it well-suited for industries where space efficiency and component reliability are paramount.

Intel’s EPM570GF256C5N, being part of the active product catalog, ensures ongoing support and availability, making it a trustworthy choice for professionals involved in the design and maintenance of electronic systems across various fields. Such fields include but are not limited to telecommunications, automotive systems, consumer electronics, and industrial automation, where the reliability and flexibility of CPLD implementations play a critical role in both the development and lifecycle management of innovative solutions.