The Intel EPM570GF256C3N leads the MAX® II series of CPLDs, meeting the high standards required by cutting-edge design and development in a broad spectrum of applications. With its advanced 256-BGA packaging, this component offers robust surface-mount solutions, ensuring a tight and efficient fit onto PCBs. Designed with 160 I/O pins, it facilitates complex and versatile interfacing, perfect for intricate electronic systems requiring a high degree of connectivity.

Operating within a temperature range of 0°C to 85°C, the EPM570GF256C3N is optimized for performance in environments that demand reliability under varying thermal conditions, making it an ideal selection for industrial, telecommunications, and automotive sectors, among others. Its configuration in a 256-FBGA (17×17) supplier device package is indicative of Intel’s commitment to quality and performance.

As part of the active product line, the EPM570GF256C3N CPLD stands out for its exceptional programmability and integration capabilities, cementing its role in the development of sophisticated digital systems. This component is a testimony to Intel’s leadership in semiconductor innovation, offering a solution that combines efficiency, performance, and versatility.

Professionals engaging in the design and deployment of advanced electronic systems will find the EPM570GF256C3N not only meets but exceeds expectations, seamlessly integrating into various technological ecosystems and broadening the horizon of what’s possible within the realms of digital innovation.