The EPM570F256C4N by Intel, a premier component in the MAX® II series, stands out in the market of Complex Programmable Logic Devices (CPLDs). Engineered for high performance, this CPLD is presented in a 256-Ball Grid Array (BGA) package, designed for efficient surface mount applications. With its package size of 256-FBGA (17×17), it provides a compact footprint while offering a vast array of 160 Input/Output (I/O) options, catering to a broad spectrum of digital logic implementations and design requirements.

This device operates within the temperature range of 0°C to 85°C (TJ), ensuring reliability in various environmental conditions. Its status as an active component underscores Intel’s commitment to longevity and support for their products, making it an ideal choice for designers and engineers looking for sustainable solutions.

Key details include:
– Manufacturer: Intel
– Category: CPLDs
– Series: MAX® II
– Packaging: Tray
– Package / Case: 256-BGA
– Mounting Type: Surface Mount
– Operating Temperature Range: 0°C ~ 85°C (TJ)
– Supplier Device Package: 256-FBGA (17×17)
– Part Status: Active
– Number of I/O: 160

Widely recognized for its versatility, the EPM570F256C4N has found applications across various industries, including but not limited to telecommunications, automotive electronics, consumer electronics, and industrial manufacturing. Its robust I/O capabilities combined with the reliability of Intel’s manufacturing, make it an essential component for developers aiming to produce sophisticated digital systems requiring high levels of logic integration and flexibility.