The Intel EPM570F256C3N, a member of the prestigious MAX® II series, stands as a high-performance Complex Programmable Logic Device (CPLD). This component is encapsulated in a 256-BGA (Ball Grid Array) package, designed for surface mount applications, ensuring a compact footprint on printed circuit boards. Its robust design encompasses an impressive array of 160 I/O ports, catering to a variety of digital interfacing requirements. The device operates efficiently within a temperature range of 0°C to 85°C, making it suitable for use in a broad spectrum of environments.

Intel’s MAX® II series is renowned for offering CPLDs that combine low power consumption with high functionality, making the EPM570F256C3N an ideal candidate for intricate logic operations in the tech industry. The component’s active status indicates its ongoing relevance and availability in the market, ensuring it remains a dependable choice for the design and development of advanced technological systems.

Industries that benefit from the incorporation of the EPM570F256C3N include, but are not limited to:
– Telecommunications for infrastructure equipment
– Industrial applications for automation and control systems
– Automotive sectors for vehicle control units.

Key features of the EPM570F256C3N include:
– Packaging in Tray form factor for secure transportation and handling.
– 256-FBGA package ensuring a minimal physical footprint.
– Surface Mount configuration for modern PCB assembly processes.
– Operating temperatures suited for a wide range of environmental conditions.
– A generous count of 160 I/Os supporting diverse digital connections.

This component reflects Intel’s commitment to advancing the field of programmable logic devices, embedding both innovation and reliability into the core of technological advancements. Its application across various industries underscores its versatility and the trust professionals place in Intel’s manufacturing prowess.