The Intel EPM2210GF256I5N, a high-performance part of the MAX® II series, stands out as one of the most dynamic Complex Programmable Logic Devices (CPLDs) in the market. With its 256-BGA packaging, this component offers a compact, yet powerful solution for various complex digital systems. Its surface mount design optimizes board space, making it a preferred choice for designers focused on creating sleek, efficient products.

With an expansive array of 204 I/O pins, the EPM2210GF256I5N provides an unprecedented level of versatility, allowing it to meet the sophisticated requirements of numerous applications. The operating temperature range of -40°C to 100°C ensures reliable performance across a wide array of environmental conditions, ensuring its suitability for deployment in challenging settings.

The component’s package, a 256-FBGA (17×17), is specifically designed to promote optimal thermal management and signal integrity, which are crucial for maintaining the efficiency and reliability of the device across all operating conditions. This attribute, combined with its robust construction, renders it an ideal choice for demanding applications across various industries, including but not limited to, telecommunications, automotive, and industrial automation sectors.

By maintaining an active part status, Intel underscores its commitment to providing ongoing support and availability for the EPM2210GF256I5N, thereby ensuring that design engineers can integrate this CPLD into both existing and future projects without concerns about obsolescence or supply chain disruptions.