The EPM2210F324I5N is a high-performance Complex Programmable Logic Device (CPLD) from Intel’s MAX® II series, specifically designed for advanced system-level chip integration. This component is housed in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package, measuring 19×19, optimized for surface mounting on printed circuit boards. The CPLD operates within an extended temperature range of -40°C to 100°C (TJ), ensuring reliability and functionality under varying environmental conditions.

With 272 available input/output lines, this device provides a flexible and ample interface for complex digital systems, supporting a wide array of applications across various industries, including but not limited to telecommunications, automotive electronics, and industrial control systems. The MAX® II series CPLDs are recognized for their low power consumption and high-speed performance, making the EPM2210F324I5N an ideal solution for implementing logic functions in electronic designs that require efficiency and minimal power loss.

This active part is delivered in a tray packaging, facilitating easy handling and integration into manufacturing and assembly processes. Its surface mount design aligns with the industry trend towards compact and dense circuit configurations, facilitating the development of more streamlined and efficient electronic products.

As a product of Intel, a leader in semiconductor innovation, the EPM2210F324I5N CPLD stands out for its robust design, high functionality, and adaptability, meeting the rigorous demands of professionals in the field looking for high performance, reliability, and scalability in their digital and logic solutions.