The Intel EPM2210F324C5N is part of the esteemed MAX® II series, focusing on the complex programmable logic devices (CPLDs) category. Emphasizing high integration, this component is packaged efficiently in a 324-Ball Grid Array (BGA), specifically designed for surface mount technology, making it a standard choice for sophisticated printed circuit board (PCB) designs. Its operating temperature ranges from 0°C to 85°C, accommodating a wide spectrum of environmental conditions. The device’s packaging in trays underscores the care in handling and delivering these precision components.

Key attributes include:

– Manufacturer: Intel, a leading name in microelectronics, assures cutting-edge technology and reliability.
– Package / Case: Ensconced in a robust 324-FBGA package measuring 19×19, the device guarantees optimal performance in a compact footprint.
– Operation Temperature: Built to function in diverse conditions, with a threshold ranging from 0°C to 85°C.
– Mounting Type: Its surface-mount configuration aligns with modern manufacturing processes, facilitating streamlined assembly and miniaturization.
– Supplier Device Package: The 324-FBGA highlights its design for efficient thermal management and high-speed signal integrity.
– Part Status: Classified as active, ensuring it is readily available for both new designs and existing system upgrades.
– Number of I/O: With 272 inputs/outputs, this CPLD stands out for its extensive interfacing capacity, supporting complex design requirements.

Industries that commonly utilize the EPM2210F324C5N include:

– Telecommunications, for its high-speed data processing and reliability.
– Consumer Electronics, due to its flexibility and efficiency in power management.
– Automotive applications, benefiting from its robustness and operational temperature range.
– Aerospace and Defense, where precision and dependability are paramount.

The Intel EPM2210F324C5N CPLD from the MAX® II series brings unparalleled efficiency, reliability, and performance to a broad array of applications, reflecting Intel’s commitment to innovation and quality in electronic components.