The EPM2210F256C5N from Intel is a high-performance Complex Programmable Logic Device (CPLD) belonging to the innovative MAX® II series, renowned for its low power consumption and versatile programmability. This device is housed in a 256-Ball Grid Array (BGA) package, specifically designed for surface mount technology, making it ideal for dense board layouts where space is at a premium.

Constructed to operate within a junction temperature range of 0°C to 85°C, the EPM2210F256C5N ensures reliable performance across various environments. With an active part status, this CPLD features a substantial number of inputs/outputs, totaling 204, facilitating extensive connectivity and functionality for complex digital systems.

Typically utilized in the telecommunications, automotive, consumer electronics, and industrial markets, the EPM2210F256C5N excels in applications demanding high integration, programmability, and the need for a low power footprint.

Key features include:

– Manufacturer: Intel
– CPLD Type: MAX® II Series
– Package: 256-FBGA (17×17)
– Mounting Type: Surface Mount
– Operating Temperature Range: 0°C ~ 85°C
– Supplier Device Package: 256-FBGA
– Number of I/O: 204
– Packaging: Tray
– Part Status: Active

This component is crucial for developing advanced, compact, and energy-efficient digital systems, underscoring Intel’s commitment to providing cutting-edge technology for a broad spectrum of electronic applications.