The EPM2210F256C4N from Intel is a high-performance Complex Programmable Logic Device (CPLD) that belongs to the acclaimed MAX® II series. This component is delivered in a tray packaging format, featuring a compact 256-Ball Grid Array (BGA) package designed for surface mount applications. The device operates within a junction temperature range of 0°C to 85°C, ensuring reliability across various operational environments.

With a generous provision of 204 input/output (I/O) pins, the EPM2210F256C4N offers ample connectivity for complex digital systems, making it an ideal choice for designers and engineers focused on creating sophisticated control and interfacing solutions. Its BGA package, with dimensions encapsulated within a 256-FBGA (17×17) footprint, allows for a high degree of integration into space-constrained designs, reflecting Intel’s commitment to producing efficient, high-density devices.

This CPLD from the MAX® II series stands out due to its active part status, indicating ongoing manufacturer support and availability, which is crucial for long-term projects and system maintenance. The EPM2210F256C4N is employed across a variety of industries, including but not limited to telecommunications, automotive systems, industrial controls, and consumer electronics, where its ability to perform complex logic operations with quick reconfigurability is highly valued.

In summary, the Intel EPM2210F256C4N CPLD represents a blend of performance, versatility, and reliability, making it a suitable component for advanced digital system designs requiring a considerable number of I/O interfaces and operational stability within the specified temperature range.