The Intel EPM1270M256C4N, belonging to the renowned MAX® II series, stands out as a high-performance Complex Programmable Logic Device (CPLD) engineered to meet the rigorous requirements of sophisticated digital systems. This component, packaged in a 256-TFBGA (Thin Fine Pitch Ball Grid Array) with a surface mount design, offers a compact solution without compromising on functionality and reliability. Its operating temperature range from 0°C to 85°C ensures stable performance across a variety of environmental conditions.

Key Features:

– Part of the Intel MAX® II series, known for its low power consumption and high functionality.
– Encased in a 256-TFBGA package, optimizing board space without sacrifice to performance.
– Supports surface mount technology for efficient assembly and manufacturing processes.
– Operates effectively within a temperature range of 0°C to 85°C, accommodating a wide array of operating conditions.
– Provides a substantial number of Inputs/Outputs (I/O), totaling at 212, facilitating complex and versatile connectivity options for various applications.

The EPM1270M256C4N is active and widely implemented in various industries, including but not limited to telecommunications, automotive electronics, consumer electronics, and data processing systems. Its robust design and versatile features make it an optimal choice for developers and engineers seeking a reliable, high-capacity logic solution for sophisticated electronic designs.