The EPM1270GF256I5N, crafted by Intel, is a highly capable CPLD belonging to the esteemed MAX® II series, indicative of its advanced programmable logic capabilities. This component is meticulously packaged in a 256-BGA configuration, ensuring robust and reliable interconnections for sophisticated electronic assemblies. The part’s surface mount design facilitates streamlined manufacturing processes, allowing for efficient integration into a variety of circuit boards.

Operating across a broad temperature range from -40°C to 100°C, the EPM1270GF256I5N delivers exceptional performance stability in demanding environmental conditions, making it suitable for a diverse array of industrial applications. Its form factor is encapsulated within a 256-FBGA package with dimensions of 17×17, optimizing board space without compromising functionality.

With an impressive array of 212 I/O ports, this component offers expansive connectivity options, catering to complex digital logic designs and facilitating extensive data manipulation and interface capabilities. The active status of this part asserts its ongoing relevance and availability in the market, ensuring it is a viable option for current and future project designs.

Intel’s MAX® II series is renowned for its low power consumption and high functionality, making the EPM1270GF256I5N an ideal choice for energy-efficient yet powerful circuit designs across various industries. Whether incorporated into telecommunications equipment, automotive systems, or consumer electronics, this CPLD stands out as a versatile and highly functional component for sophisticated electronic solutions.