The Intel EPM1270F256I5 is a high-performance Complex Programmable Logic Device (CPLD) from the renowned MAX® II series, designed to meet the advanced requirements of rapid prototyping and system integration in a compact 256 Ball Grid Array (BGA) package. With its 212 input/output (I/O) pins, this CPLD offers ample flexibility for interfacing with a wide range of peripherals and devices, making it an indispensable component in the development and optimization of complex digital systems.

Mounted on a surface mount 256-FBGA package with dimensions of 17×17, the EPM1270F256I5 is engineered for reliable operation across a wide temperature range from -40°C to 100°C (TJ), ensuring stable performance in even the most demanding environments. This robust operating temperature range, combined with its compact form factor, makes it particularly well-suited for applications in the industrial, automotive, and telecommunications sectors where reliability and space economy are critical considerations.

The device is shipped in trays, indicating it’s meant for high-volume production environments where efficiency and consistency in handling are essential. Currently classified as active, this CPLD represents Intel’s ongoing commitment to providing long-term support and availability for their products, making it a reliable choice for both new designs and legacy system upgrades.

Intel’s MAX® II series is notable for its low-power consumption and ease of programming, making the EPM1270F256I5 a flexible and energy-efficient solution for a broad range of digital logic applications, from complex device interfaces to customizable logic tile arrays and beyond.