The Intel EPM1270F256C5NRR is a highly versatile and high-quality product within the well-regarded MAX® II series. This device belongs to the CPLD (Complex Programmable Logic Devices) category, offering sophisticated clock management and superior programmable interconnects capabilities. Known for its efficiency and high performance, the EPM1270F256C5NRR comes in a 256-BGA (Ball Grid Array) package, ensuring high-density lead counts and efficient heat dissipation.

This CPLD component is actively produced and delivered in Tray Packaging. The operational range it adheres to an industry-standard range of 0°C ~ 85°C (TJ), optimizing its performance in most industrial environments. The surface mount mounting type facilitates easy installation and efficient board space utilization in your applications. Supplied as a Supplier Device Package 256-FBGA (17×17), this CPLD component further enhances overall system design flexibility.

With a generous amount of 212 I/O, the EPM1270F256C5NRR offers exceptional design flexibility. It’s well-suited for use in multiple sectors, including but not limited to telecommunication, networking, video processing, and consumer electronics applications. Its highly adaptive nature underscored by the brand reputation of Intel makes it an indispensable resource when high performance, durability, and flexibility become quintessential in integrated circuit design solutions.