The EPM1270F256C5NAB, part of Intel’s renowned MAX® II series, stands out as a high-performance Complex Programmable Logic Device (CPLD). Intel, a leader in the development and manufacturing of advanced semiconductor technology, offers this CPLD in a 256-Ball Grid Array (BGA) packaging, optimized for efficient heat dissipation and smaller footprint on printed circuit boards. Its surface mount configuration allows for direct integration into a variety of electronic assemblies.

This component operates within a temperature range of 0°C to 85°C (TJ), ensuring reliability across various environmental conditions. The device’s package size, specified as 256-FBGA (17×17), makes it suitable for compact designs without compromising on functionality. With an active part status, the EPM1270F256C5NAB guarantees availability and support for ongoing and new projects alike.

Boasting 212 input/output (I/O) ports, this CPLD offers ample connectivity for complex digital logic circuits, enabling it to support a wide array of applications. Its versatile nature makes it an essential component in industries ranging from telecommunications and automotive to consumer electronics and industrial automation. The MAX® II series is renowned for providing low power consumption alongside a high degree of logic customization, making it an intelligent choice for designers looking to optimize their systems for both performance and efficiency.

In summary, the EPM1270F256C5NAB CPLD by Intel is a sophisticated, yet energy-efficient option for developers aiming to leverage the benefits of programmable logic devices in their high-demand applications.