The EPM1270F256C5NAA is a high-performance, Complex Programmable Logic Device (CPLD) from Intel’s renowned MAX® II series, expertly crafted for demanding applications requiring a flexible, low-cost programmable logic solution. Featuring a dense 256-BGA (Ball Grid Array) package, this component is designed for efficient surface mounting to ensure a compact footprint on the printed circuit board, making it an excellent choice for space-constrained environments.

With an impressive array of 212 input/output (I/O) lines, this CPLD offers unparalleled flexibility for interfacing with a wide range of peripheral devices, supporting complex designs without compromising performance or power efficiency. The operating temperature range of 0°C to 85°C (TJ) guarantees reliable performance across various environmental conditions, ensuring that your projects remain operational regardless of external thermal challenges.

Encased in a sturdy 256-FBGA package with a size of 17×17 mm, the EPM1270F256C5NAA is engineered for surface mount technology (SMT) applications, highlighting Intel’s commitment to providing advanced solutions that meet the rigorous requirements of modern electronic designs. The widespread use of this component across various industries, including telecommunications, consumer electronics, automotive systems, and more, underscores its versatility and reliability in enabling sophisticated digital logic functions.

As an active part of Intel’s MAX® II series, the EPM1270F256C5NAA continues to set industry standards in programmable logic, empowering developers and designers with a platform that combines efficiency, cost-effectiveness, and high performance, making it an indispensable tool in the creation of cutting-edge technology solutions.