The EPM1270F256C5N is a cutting-edge CPLD (Complex Programmable Logic Device) from Intel’s renowned MAX® II series, designed to meet the sophisticated requirements of modern digital systems. This device is packaged in a compact 256-BGA (Ball Grid Array) package, making it ideal for high-density applications where space is at a premium. It offers a generous array of 212 I/O (Input/Output) pins, providing ample connectivity options for complex designs.

With an operating temperature range of 0°C to 85°C (TJ), the EPM1270F256C5N ensures reliable performance across a wide range of environmental conditions, making it suitable for industrial, automotive, and consumer applications. The surface mount design, complemented by its 256-FBGA (17×17) supplier device package, aligns with the contemporary trend towards more compact and efficient circuit designs.

Intel’s MAX® II series is synonymous with high performance and low power consumption, characteristics that are embodied in the EPM1270F256C5N. This device is tailored for applications requiring flexible, reconfigurable logic solutions that can be customized to meet specific design needs. Whether it’s for implementing complex digital logic circuits, system-level integration, or as a key component in embedded systems, this CPLD stands out for its versatility and robustness.

In conclusion, the EPM1270F256C5N represents a blend of Intel’s innovation in CPLD technology, providing engineers and designers with a powerful tool for creating advanced digital systems. Its broad operational range, high I/O count, and compact form factor make it an exemplary choice for a variety of applications across multiple industries.