The EPM1270F256C5 is a high-performance CPLD (Complex Programmable Logic Device) from Intel’s MAX® II series, catering to advanced applications in digital logic circuits. Packaged in a 256-ball grid array (BGA) format and designed for surface mount technology, this CPLD offers a compact solution for intricate digital systems. Its operating temperature range from 0°C to 85°C ensures reliability across various environmental conditions.

With a supplier device package size of 256-FBGA (17×17), the EPM1270F256C5 provides a dense and efficient layout for electronic assembly, facilitating ease of integration into a broad spectrum of applications. This component is notably active, signifying its ongoing production and support from Intel, one of the leading manufacturers in the semiconductor industry.

The device boasts an impressive array of 212 I/O (Input/Output) ports, allowing for versatile connections and high-level interfacing capabilities with other components within a system. This feature positions the EPM1270F256C5 as an essential building block in the design and development of complex digital systems found in industries such as telecommunications, computing, industrial control, and automotive systems where high-speed logic, and robust performance are crucial.

For professionals engaged in the design and implementation of cutting-edge digital systems, the EPM1270F256C5 offers a combination of high functionality, reliability, and versatility, backed by Intel’s reputation for quality and innovation in CPLD technology.