The EPM1270F256C3N is a high-performance CPLD (Complex Programmable Logic Device) from Intel’s renowned MAX® II series, renowned for its low power consumption and high functionality in a compact form factor. This device is packaged in a 256-BGA (Ball Grid Array) format, ensuring a secure, surface-mount connection for reliable performance across various applications. Its operating temperature range of 0°C to 85°C (TJ) makes it suitable for use in environments that demand stability and resilience.

With 212 Input/Output pins, this component offers extensive interfacing capabilities, making it an ideal choice for intricate digital systems that require a wide array of connections. The supplier’s device package is specified as 256-FBGA (17×17), providing a compact, efficient footprint for tightly integrated PCB (Printed Circuit Board) designs.

As an active component, the EPM1270F256C3N continues to be a preferred choice for designers and engineers working in demanding sectors such as telecommunications, computing, industrial automation, and consumer electronics due to its versatility and programming efficiency. The MAX® II series CPLDs are celebrated for their ease of use, low cost of ownership, and capability to support a myriad of logic functions, making them integral to innovative digital designs that push the boundaries of technology forward.