The EPCQL1024F24IN, part of Intel’s EPCQ-L series, stands as a specialized Configuration PROM for FPGAs (Field Programmable Gate Arrays). This component is delivered in a tray packaging format, designed to promote ease of handling and integration into manufacturing processes.

Crafted with a 24-LBGA (Leadless Chip Carrier) package, the EPCQL1024F24IN adheres to a surface mount technology, ensuring a compact and efficient footprint for high-density printed circuit board (PCB) designs. The device’s surface mount configuration allows for streamlined assembly processes, significantly reducing production times and costs for electronic equipment manufacturers.

Operating within a temperature range of -40°C to 85°C, this PROM offers reliable performance across various environmental conditions, making it suitable for a wide array of industrial applications. Its supplier device package is specified as 24-FBGA (6×8), highlighting its advanced packaging technology that aids in enhanced thermal management and reduced inductance, thereby improving performance and reliability.

Despite its classification as an obsolete product, the EPCQL1024F24IN remains an integral component within certain legacy systems across several industries. It provides essential configuration storage for FPGAs, allowing for the dynamic programming of these devices to suit specific application requirements.

This configuration PROM’s robust design, coupled with Intel’s renowned manufacturing quality, assures dependable operation in sophisticated electronic systems. It is a critical component for seasoned professionals seeking to maintain or repair existing equipment within the telecommunications, computing, industrial, and consumer electronics sectors, where the precise configuration of FPGAs plays a pivotal role in overall system functionality.