The Intel EPC8QI100N is a highly specialized configuration PROM designed for FPGA (Field-Programmable Gate Array) systems, underlining its importance in programming and configuring FPGA devices for a wide array of applications. This component, belonging to Intel’s reputable EPC series, is tailored for robust, high-performance operations, evident through its optimal packaging and mounting specifications.

Characterized by its 100-BQFP (Quad Flat Package), the EPC8QI100N ensures a reliable interface with printed circuit boards (PCBs), facilitating surface mount technology for secure and efficient assembly. The device’s package, housed in a tray for delivery, underscores a commitment to safeguarding the integrity of each unit during transportation and handling.

Key specifications include:
– Package / Case: 100-BQFP, accommodating the spatial and circuitry needs for advanced electronic systems.
– Mounting Type: Surface Mount, enabling streamlined soldering and manufacturing processes, pivotal for high-density PCB layouts.
– Operating Temperature Range: -40°C to 85°C, ensuring resilience and consistent performance across a broad spectrum of environmental conditions.
– Supplier Device Package: 100-PQFP (20×14), highlighting the precise form factor designated for optimal fitting and function within a system.

Although regarded as obsolete, the EPC8QI100N’s legacy in driving FPGA configurations remains significant. Its application spans numerous industries, including telecommunications, consumer electronics, automotive systems, and aerospace engineering, showcasing its versatility and impact in advancing technological infrastructures.

This component’s technical attributes affirm its role in the foundational support of complex electronic systems, ensuring reliability, efficiency, and precision in FPGA-based applications.