The EPC1LC20N by Intel stands as a pivotal component in the field of Configuration PROMs for FPGAs, belonging to the distinguished EPC series. With its packaging carefully secured in a tube format, this part underscores a commitment to quality and reliability. Encased in a 20-LCC (J-Lead) package, the product assures a streamlined integration into surface-mounted technology environments, thanks to its surface mount design.

Intel has precisely engineered the EPC1LC20N to operate efficiently within a temperature range from 0°C to 70°C, demonstrating its resilience and performance stability under varying environmental conditions. The supplier has chosen a 20-PLCC (9×9) device package, which further indicates the component’s adaptability to a myriad of FPGA configuration scenarios.

Despite its current status as obsolete, the EPC1LC20N remains a significant piece in the legacy of FPGA configuration solutions. Its utilitarian value extends across various industries, underscoring its versatility and enduring importance in applications that rely on older but still relevant technological frameworks.

Critical for professionals in the field, this component encapsulates Intel’s commitment to innovation and reliability within the realm of FPGA configuration, adhering to the highest standards of quality and performance.