The Intel EPC16QC100N, part of the esteemed EPC series, embodies a quintessential solution in Configuration PROMs specifically designed for FPGA (Field-Programmable Gate Array) applications. This component is housed in a 100-BQFP (Bumpered Quad Flat Package), ensuring robust physical protection and efficient thermal characteristics suitable for surface-mount technology. With its packaging executed in trays, the EPC16QC100N ensures secure handling and logistical efficiency.

Optimized for operation in a temperature range from 0°C to 70°C, this product is tailored for environments demanding stable performance under varied thermal conditions. The device is encapsulated within a 100-PQFP (Plastic Quad Flat Package), measuring 20×14, which provides a compact footprint suitable for densely populated boards where space optimization is crucial.

Though marked as obsolete, the legacy of the EPC16QC100N in configuring FPGAs remains significant, offering insights into the evolution of programming and setup methodologies for complex integrated systems. This component has found application across a myriad of industries, including but not limited to telecommunications, data processing, and high-speed computing solutions, showcasing its versatility and the broad applicability of FPGAs in facilitating advanced technological ecosystems.

Intel’s EPC16QC100N represents a specialized component catering to the intricate needs of FPGA setups, emphasizing the importance of precise configuration PROMs in the deployment of adaptable and efficient digital circuits.