The MC33771BSP1AER2 is a state-of-the-art battery management component from NXP USA Inc., catering specifically to the rigorous standards of the automotive industry, and is compliant with the AEC-Q100 specification for high reliability. This component belongs to the esteemed automotive series known for its precision in monitoring and controlling the battery states to ensure optimal performance and longevity of battery systems.

Encased in a robust 64-LQFP package with an exposed pad for enhanced thermal dissipation, this battery management chip is designed for surface mount technology applications, ensuring a compact and reliable integration into automotive electronic systems. Its package dimensions are meticulously crafted to fit into a 10×10 mm footprint, allowing for efficient use of PCB space.

With an operating temperature range extending from -40°C to 105°C (TA), the MC33771BSP1AER2 is engineered to withstand the harsh conditions of automotive environments, ensuring reliability and performance under extreme temperatures. This capability makes it an ideal choice for electric vehicles, hybrid electric vehicles, and other automotive applications requiring stringent battery management solutions.

The MC33771BSP1AER2 is supplied in a Tape & Reel (TR) packaging format, facilitating efficient assembly processes for high-volume production. Its active part status signifies NXP USA Inc.’s commitment to providing ongoing support and availability for this critical component in advanced battery management systems.

Overall, the MC33771BSP1AER2 embodies a blend of advanced technology and reliability, making it a cornerstone for developers looking to innovate within the automotive sector’s evolving landscape.