Home

Products

Integrated Circuits (ICs)

Logic

Flip Flops

74LVT374D,118

Banner
productimage

74LVT374D,118

IC FF D-TYPE SNGL 8BIT 20SO

Manufacturer: NXP USA Inc.

Categories: Flip Flops

Quality Control: Learn More

NXP USA Inc. 74LVT series D-Type flip-flop, part number 74LVT374D-118, is an 8-bit, single-element device featuring positive edge triggering. This component is housed in a 20-SOIC package with a 7.50mm width. It operates from a 2.7V to 3.6V supply voltage and supports a clock frequency of up to 200 MHz. The output stage provides Tri-State, Non-Inverted signals with drive capabilities of 32mA high and 64mA low. Typical propagation delay is 5.2ns at 3.3V and 50pF. Input capacitance is rated at 4pF, with quiescent current at 190 µA. This device is suitable for applications in industrial, telecommunications, and consumer electronics. It is supplied in Tape & Reel (TR) packaging.

Additional Information

Series: 74LVTRoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)
Technical Details:
PackagingTape & Reel (TR)
Package / Case20-SOIC (0.295"", 7.50mm Width)
Output TypeTri-State, Non-Inverted
Mounting TypeSurface Mount
Number of Elements1
FunctionStandard
TypeD-Type
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply2.7V ~ 3.6V
Current - Quiescent (Iq)190 µA
Current - Output High, Low32mA, 64mA
Trigger TypePositive Edge
Clock Frequency200 MHz
Input Capacitance4 pF
Supplier Device Package20-SO
Max Propagation Delay @ V, Max CL5.2ns @ 3.3V, 50pF
Number of Bits per Element8

Request a Quote

Name (required)

Phone (required)

Work Email (required)

Country (required)

Company Name (required)

CAPTCHA

By providing a telephone number and submitting the form, you are consenting to be contacted by SMS text message and agreeing to our Privacy Policy. Message frequency may vary. Message and data rates may apply. Reply STOP to opt out of further messaging. Reply HELP for more information.
Clients Also Buy
NXP FAQs

NXP Semiconductors manufactures mixed-signal, analog, and embedded semiconductor components focused on secure connectivity and intelligent systems.

NXP’s core components include:

  • Microcontrollers (MCUs) and microprocessors (MPUs)
  • Automotive semiconductors (ADAS, radar, in-vehicle networking)
  • RF and wireless communication chips (including NFC and UWB)
  • Secure identification and authentication ICs
  • Power management and analog ICs
  • Sensors and interface solutions

NXP specializes in secure, connected solutions for automotive, industrial, and IoT applications.

NXP serves industries that require secure connectivity, embedded processing, and real-time control.

NXPs key industries include:

  • Automotive and electric vehicles (EVs)
  • Industrial automation and smart factories
  • Internet of Things (IoT) and smart devices
  • Mobile and secure identification (payments, access control)
  • Communications and networking infrastructure
  • Smart cities and infrastructure

These industries rely on NXP for security, connectivity, and high-reliability embedded solutions.

NXP is known for embedded processing, secure connectivity, and automotive semiconductor product lines.

Key NXP product lines include:

  • i.MX series - application processors for industrial and multimedia applications
  • MPC5500 - microcontrollers for automotive and industrial control applications
  • M68HC11- 8-bit microcontrollers for legacy embedded control systems
  • Layerscape processors - networking processors for communications infrastructure
  • Kinetis MCUs - scalable microcontrollers for industrial and IoT applications
  • LPC series - ARM-based microcontrollers for embedded systems
  • S32 automotive platform - processors and MCUs for automotive applications
  • PN series (NFC controllers) - near-field communication solutions
  • SR series (secure elements) - security ICs for authentication and payments
  • TEA series - power management ICs
Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.