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SY100E122JC

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SY100E122JC

IC BUF NON-INVERT -5.5V 28PLCC

Manufacturer: Microchip Technology

Categories: Buffers, Drivers, Receivers, Transceivers

Quality Control: Learn More

Microchip Technology SY100E122JC is a 9-element, non-inverting buffer featuring push-pull outputs. This component, part of the 100E series, operates with a supply voltage range of -4.2V to -5.5V and is housed in a 28-PLCC package. Each buffer element is designed for a single bit. The SY100E122JC is suitable for high-speed applications in telecommunications, networking, and computing systems. Its surface mount design and operating temperature range of -40°C to 85°C make it a versatile choice for demanding environments.

Additional Information

Series: 100ERoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: DiscontinuedPackaging: BulkDatasheet:
Technical Details:
PackagingBulk
Package / Case28-LCC (J-Lead)
Output TypePush-Pull
Mounting TypeSurface Mount
Number of Elements9
Logic TypeBuffer, Non-Inverting
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply-4.2V ~ -5.5V
Input Type-
Number of Bits per Element1
Current - Output High, Low-
Supplier Device Package28-PLCC (11.48x11.48)

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

Frequently Asked Questions

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.