XC17S150APDG8I
Configuration Memory, 1040096X1, Serial, CMOS, PDIP8Manufacturer: Xilinx
Categories: EEPROMs
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The Xilinx XC17S150APDG8I is a serial CMOS configuration memory device from the XC17S150 series. This component offers a memory density of 1040096 x 1 bits, organized as 1040096 words with a single data bit per word. It operates synchronously with a supply voltage range of 3.0V to 3.6V, typically 3.3V, and features a low standby current of 50µA maximum. The device is housed in an 8-pin PDIP package with through-hole mounting and a terminal pitch of 2.54mm. Operating temperature ranges from -40°C to +85°C. This configuration memory is suitable for applications in telecommunications, industrial control, and consumer electronics requiring reliable device configuration.
Additional Information
Series: XC17S150RoHS Status: RoHS CompliantManufacturer Lead Time: Product Status: DiscontinuedPackaging: TubeDatasheet:Download Free CAD Model:
Technical Details:
| Length | 9.3599 |
| Width | 7.6200 |
| Technology | CMOS |
| JESD_30_Code | R-PDIP-T8 |
| Memory_Density | 1040096.0000000000000000 |
| Memory_IC_Type | CONFIGURATION MEMORY |
| Memory_Organization | 1040096X1 |
| Memory_Width | 1 |
| Number_of_Functions | 1 |
| Number_of_Terminals | 8 |
| Number_of_Words | 1040096.0000000000000000 |
| Number_of_Words_Code | 1040096 |
| Operating_Mode | Synchronous |
| Operating_Temperature_Max | 85.0 |
| Operating_Temperature_Min | -40.0 |
| Package_Body_Material | PLASTIC/EPOXY |
| Package_Code | DIP |
| Package_Equivalence_Code | DIP8,.3 |
| Package_Shape | Rectangular |
| Package_Style | IN-LINE |
| Parallel_Serial | Serial |
| Programming_Voltage | 5 |
| Seated_Height_Max | 4.5974 |
| Standby_Current_Max | 0.000050000000000 |
| Supply_Current_Max | 10.000000000000000 |
| Supply_Voltage_Max | 3.60000 |
| Supply_Voltage_Min | 3.00000 |
| Supply_Voltage_Nom | 3.3 |
| Surface_Mount | No |
| Terminal_Form | THROUGH-HOLE |
| Terminal_Pitch | 2.540 |
| Terminal_Position | Dual |