W987D6HBGX6I
IC DRAM 128MBIT PAR 54VFBGAManufacturer: Winbond Electronics
Categories: Memory
Quality Control: Learn More
Winbond Electronics W987D6HBGX6I is a 128Mbit Mobile Low-Power SDRAM device. This component features a parallel interface, operating at a clock frequency of 166 MHz with an access time of 5.4 ns. The memory organization is 8M x 16, and it utilizes the SDRAM - Mobile LPSDR technology. The W987D6HBGX6I is supplied in a 54-VFBGA (8x9) package, designed for surface mount applications. It operates within a voltage range of 1.7V to 1.95V and is rated for an operating temperature of -40°C to 85°C. Typical applications for this memory component include consumer electronics and communication systems.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 54-TFBGA |
| Mounting Type | Surface Mount |
| Memory Size | 128Mbit |
| Memory Type | Volatile |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Voltage - Supply | 1.7V ~ 1.95V |
| Technology | SDRAM - Mobile LPSDR |
| Clock Frequency | 166 MHz |
| Memory Format | DRAM |
| Supplier Device Package | 54-VFBGA (8x9) |
| Write Cycle Time - Word, Page | 15ns |
| Memory Interface | Parallel |
| Access Time | 5.4 ns |
| Memory Organization | 8M x 16 |
| Programmable | Not Verified |
Request a Quote
Clients Also Buy
W25Q256JVCIM
IC FLASH 256MBIT SPI 24TFBGA
W972GG8KS-18
IC DRAM 2GBIT PARALLEL 60WBGA
W25X16AVSNIG
IC FLASH 16MBIT SPI 75MHZ 8SOIC
