Home

Products

Integrated Circuits (ICs)

Memory

Memory

W66CP2NQUAFJ

Banner
productimage

W66CP2NQUAFJ

IC DRAM 4GBIT LVSTL 11 200WFBGA

Manufacturer: Winbond Electronics

Categories: Memory

Quality Control: Learn More

The Winbond Electronics W66CP2NQUAFJ is a 4Gbit SDRAM component designed for high-performance mobile applications. Featuring LPDDR4 technology, this device operates at a clock frequency of 2.133 GHz with an access time of 3.5 ns. The memory interface utilizes LVSTL_11 signaling, and the organization is 128M x 32. This volatile memory component is housed in a 200-WFBGA package, measuring 10x14.5 mm, and supports surface mounting. Operating temperatures range from -40°C to 105°C (TC), with supply voltages between 1.06V to 1.17V and 1.7V to 1.95V. This component is commonly found in the consumer electronics and communications industries.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 28 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size4Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4
Clock Frequency2.133 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Write Cycle Time - Word, Page-
Memory InterfaceLVSTL_11
Access Time3.5 ns
Memory Organization128M x 32
ProgrammableNot Verified

Request a Quote

Name (required)

Phone (required)

Work Email (required)

Country (required)

Company Name (required)

Open to other brands

CAPTCHA

Clients Also Buy
product image
W25Q256JVCIM

IC FLASH 256MBIT SPI 24TFBGA

product image
W972GG8KS-18

IC DRAM 2GBIT PARALLEL 60WBGA

product image
W25X16AVSNIG

IC FLASH 16MBIT SPI 75MHZ 8SOIC