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W66BQ6NBUAFJ TR

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W66BQ6NBUAFJ TR

IC DRAM 2GBIT LVSTL 11 200WFBGA

Manufacturer: Winbond Electronics

Categories: Memory

Quality Control: Learn More

Winbond Electronics W66BQ6NBUAFJ-TR is a 2Gbit Mobile LPDDR4X SDRAM device, featuring a 128M x 16 memory organization. This volatile memory component operates at a clock frequency of 1.6 GHz with an access time of 3.5 ns and a write cycle time of 18ns. It utilizes LVSTL_11 signaling and supports a wide supply voltage range of 1.06V to 1.95V. The W66BQ6NBUAFJ-TR is supplied in a 200-WFBGA (10x14.5) surface mount package and operates within an industrial temperature range of -40°C to 105°C. This component is commonly implemented in mobile devices, automotive electronics, and high-performance computing applications requiring efficient data storage and retrieval.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 28 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:
Technical Details:
PackagingTape & Reel (TR)
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4X
Clock Frequency1.6 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.5 ns
Memory Organization128M x 16
ProgrammableNot Verified

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