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W66BM6NBUAGJ

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W66BM6NBUAGJ

IC DRAM 2GBIT LVSTL 11 200WFBGA

Manufacturer: Winbond Electronics

Categories: Memory

Quality Control: Learn More

Winbond Electronics W66BM6NBUAGJ is a 2Gbit SDRAM - Mobile LPDDR4X memory IC. This component features a LVSTL_11 memory interface and operates at a clock frequency of 1.866 GHz with an access time of 3.5 ns. The memory organization is 128M x 16. The device is housed in a 200-WFBGA (10x14.5) package, suitable for surface mounting. It supports a wide operating temperature range of -40°C to 105°C (TC) and utilizes supply voltages between 1.06V to 1.17V and 1.7V to 1.95V. Typical applications for this type of memory include consumer electronics, mobile devices, and automotive systems where high-speed, low-power memory is critical.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: Not For New DesignsPackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case200-WFBGA
Mounting TypeSurface Mount
Memory Size2Gbit
Memory TypeVolatile
Operating Temperature-40°C ~ 105°C (TC)
Voltage - Supply1.06V ~ 1.17V, 1.7V ~ 1.95V
TechnologySDRAM - Mobile LPDDR4X
Clock Frequency1.866 GHz
Memory FormatDRAM
Supplier Device Package200-WFBGA (10x14.5)
Write Cycle Time - Word, Page18ns
Memory InterfaceLVSTL_11
Access Time3.5 ns
Memory Organization128M x 16
ProgrammableNot Verified

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