Winbond Electronics W632GG8AB-11 is a 2Gb serial interface DRAM component. This memory device features a x8 data bus width and operates at a speed of 11 ns. The W632GG8AB-11 is packaged in a 78-ball WBGA (Wafer Level Ball Grid Array) for compact integration. This component is suitable for applications requiring high-density memory, including consumer electronics, industrial control systems, and networking equipment. Its serial interface design facilitates simpler board layouts and reduced pin counts compared to parallel interfaces.
Additional Information
Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray